숙명여자대학교 비교과통합관리시스템

Invited Seminar

Department of Mechanical Systems Engineering

Advanced thermal management technologies for next generation electronic systems

날짜  2019년10월 2일 수요일

시각 12시

장소 르네상스플라자 403호

대상  공개강의(타과생 환영)

연사  이형순 교수

신청  SNOWAY 비교과 신청 가능(마일리지 2000점)

약력  Present      Assistant Professor in Mechanical Engineering, Chung-Ang University

2016          Postdoctoral Scholar in Mechanical Engineering, Stanford University

        2014        PhD in Mechanical Engineering, Purdue University

        2011        MS in Mechanical Engineering, Purdue University

        2008         Engineer, Hyundai Motors

        2006         BS in Mechanical Engineering, Korea University

As the demand for high-performance electronic systems increases, advanced thermal management techniques have received a considerable amount of attention because of their broad potential benefits, e.g., multifunctionality, increased performance, reduced power, small form factor, reduced packaging, increased yield and reliability, flexible heterogeneous integration, and reduced overall cost. There have been many studies in the past few decades aimed at developing different types of thermal management technique for delivering these benefits. The rapid emergence of new technologies such as nano-fabrication, microporous materials, 3D printing techniques has led to a steep increase in heat dissipation rate of electronics and growing concern over the emergence of on-chip hot spots. In this talk, Dr. Lee explores various thermal management techniques for next generation electronic systems. The state-of-the-art experimental skills using complex microfluidics fluid routing, and 3D stack chip cooling are addressed in detail. He then extends the study to Computational Fluid Dynamics technique for boiling and condensation in mini/micro scales.

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